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Rochester Electronics 71V3579S85PF
IC SRAM 4.5MBIT PARALLEL 100TQFP
Manufacturer # :71V3579S85PF
Manufacturer :Rochester Electronics
Dasenic # :71V3579S85PF-DS
Datasheet :
71V3579S85PF Datasheet
71V3579S85PF DatasheetCustomer # :
Description : IC SRAM 4.5MBIT PARALLEL 100TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 7+ | $ 0.3753 | $ 2.63 |
| 10+ | $ 0.3678 | $ 3.68 |
| 100+ | $ 0.3566 | $ 35.66 |
| 500+ | $ 0.3452 | $ 172.6 |
| 1000+ | $ 0.3378 | $ 337.8 |
In Stock: 28120
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3753
Total :$ 0.38
Delivery :
Payment :
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71V3579S85PF information
Rochester Electronics 71V3579S85PF technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Technology:SRAM - Synchronous, SDR
- Supplier Device Package:100-TQFP (14x14)
- Memory Size:4.5Mb (256K x 18)
- Memory Type:Volatile
- Voltage - Supply:3.135V ~ 3.465V
- Clock Frequency:-
- Access Time:8.5 ns
- Memory Format:SRAM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
71V3579S85PF provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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