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Rochester Electronics 63S281ANL

63S281 - OTP ROM, 256X8, 28NS
part number has RoHS
Manufacturer # :63S281ANL
Manufacturer :Rochester Electronics
Dasenic # :63S281ANL-DS
Customer # :
Description : 63S281 - OTP ROM, 256X8, 28NS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1590$ 3.16
25+$ 3.0960$ 77.4
100+$ 2.9700$ 297
500+$ 2.8440$ 1422
1000+$ 2.6820$ 2682
In Stock: 7595
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.159
Total :$ 3.16
Delivery :
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Payment :
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63S281ANL information

  • Rochester Electronics 63S281ANL technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 75°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:20-LCC (J-Lead)
  • Technology:-
  • Supplier Device Package:20-PLCC (9x9)
  • Memory Size:1Kb (256 x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:4.75V ~ 5.25V
  • Clock Frequency:-
  • Access Time:40 ns
  • Memory Format:PROM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:-
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.32.0071
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
63S281ANL provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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