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Rochester Electronics 5962-9205804MXC

IC DSP FLOAT-POINT 141CPGA
part number has RoHS
Manufacturer # :5962-9205804MXC
Manufacturer :Rochester Electronics
Dasenic # :5962-9205804MXC-DS
Customer # :
Description : IC DSP FLOAT-POINT 141CPGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1924.3800$ 1924.38
25+$ 1885.9000$ 47147.5
100+$ 1808.9200$ 180892
500+$ 1731.9400$ 865970
1000+$ 1635.7200$ 1635720
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1924.38
Total :$ 1924.38
Delivery :
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Payment :
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5962-9205804MXC information

  • Rochester Electronics 5962-9205804MXC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 125°C (TA)
  • Mounting Type:Through Hole
  • Package / Case:141-BCPGA Exposed Pad
  • Type:Floating Point
  • Interface:Serial Port
  • Supplier Device Package:141-CPGA (26.92x26.92)
  • Clock Rate:50MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:8.25kB
  • Voltage - I/ O:5.00V
  • Voltage - Core:5.00V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
5962-9205804MXC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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