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Rochester Electronics 5962-86833012A

IC GATE NAND 4CH 2-INP 20LCCC
part number has RoHS
Manufacturer # :5962-86833012A
Manufacturer :Rochester Electronics
Dasenic # :5962-86833012A-DS
Customer # :
Description : IC GATE NAND 4CH 2-INP 20LCCC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 45.7000$ 45.7
25+$ 44.7800$ 1119.5
100+$ 42.9600$ 4296
500+$ 41.1400$ 20570
1000+$ 38.8400$ 38840
In Stock: 1502
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 45.7
Total :$ 45.70
Delivery :
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Payment :
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5962-86833012A information

  • Rochester Electronics 5962-86833012A technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Gates and Inverters
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:20-CLCC
  • Supplier Device Package:20-LCCC (8.89x8.89)
  • Number of Circuits:4
  • Voltage - Supply:4.5V ~ 5.5V
  • Number of Inputs:2
  • Current - Quiescent ( Max):-
  • Logic Type:NAND Gate
  • Current - Output High, Low:400µA, 4mA
  • Max Propagation Delay @ V, Max C L:15ns @ 5V, 50pF
  • Logic Level - Low:0.8V
  • Logic Level - High:2V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
5962-86833012A provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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