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Rochester Electronics 2SK1658-T1-A
Manufacturer # :2SK1658-T1-A
Manufacturer :Rochester Electronics
Dasenic # :2SK1658-T1-A-DS
Datasheet : 2SK1658-T1-A Datasheet
Customer # :
Description : MOSFET N-CH 30V 100MA SC70-3 SSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.16
Total :$ 0.16
Delivery :
Payment :
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2SK1658-T1-A information
Rochester Electronics 2SK1658-T1-A technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:SC-70, SOT-323
- Technology:MOSFET (Metal Oxide)
- Supplier Device Package:SC-70-3, SSP, Miniature Mini Mold
- Power Dissipation ( Max):-
- F E T Type:N-Channel
- F E T Feature:-
- Drain to Source Voltage ( Vdss):30 V
- Current - Continuous Drain ( Id) @ 25° C:100mA (Ta)
- Rds On ( Max) @ Id, Vgs:25Ohm @ 10mA, 4V
- Vgs(th) ( Max) @ Id:1.5V @ 1µA
- Gate Charge ( Qg) ( Max) @ Vgs:-
- Input Capacitance ( Ciss) ( Max) @ Vds:15 pF @ 3 V
- Drive Voltage ( Max Rds On, Min Rds On):-
- Vgs ( Max):-
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8541.21.0095
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
2SK1658-T1-A provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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