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Rochester Electronics 2SC3651-TD-E

2SC3651 - NPN EPITAXIAL PLANAR S
part number has RoHS
Manufacturer # :2SC3651-TD-E
Manufacturer :Rochester Electronics
Dasenic # :2SC3651-TD-E-DS
Customer # :
Description : 2SC3651 - NPN EPITAXIAL PLANAR S
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1658$ 0.17
25+$ 0.1625$ 4.06
100+$ 0.1558$ 15.58
500+$ 0.1492$ 74.6
1000+$ 0.1409$ 140.9
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1658
Total :$ 0.17
Delivery :
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Payment :
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2SC3651-TD-E information

  • Rochester Electronics 2SC3651-TD-E technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
  • Product Status:Active
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:TO-243AA
  • Power - Max:500mW
  • Supplier Device Package:PCP
  • Transistor Type:NPN
  • Current - Collector ( Ic) ( Max):200mA
  • Voltage - Collector Emitter Breakdown ( Max):100V
  • Vce Saturation ( Max) @ Ib, Ic:500mV @ 2mA, 100mA
  • Current - Collector Cutoff ( Max):100nA (ICBO)
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:500 @ 10mA, 5V
  • Frequency - Transition:150MHz
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
2SC3651-TD-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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