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Rochester Electronics 2SA1766-D-TD-E

BIP PNP 0.3A 25V
part number has RoHS
Manufacturer # :2SA1766-D-TD-E
Manufacturer :Rochester Electronics
Dasenic # :2SA1766-D-TD-E-DS
Customer # :
Description : BIP PNP 0.3A 25V
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.1170$ 0.12
25+$ 0.1147$ 2.87
100+$ 0.1100$ 11
500+$ 0.1053$ 52.65
1000+$ 0.0995$ 99.5
In Stock: 36000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.117
Total :$ 0.12
Delivery :
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Payment :
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2SA1766-D-TD-E information

  • Rochester Electronics 2SA1766-D-TD-E technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Power - Max:-
  • Supplier Device Package:-
  • Transistor Type:-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • Vce Saturation ( Max) @ Ib, Ic:-
  • Current - Collector Cutoff ( Max):-
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:-
  • Frequency - Transition:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8541.29.0075
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
2SA1766-D-TD-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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