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Rochester Electronics 2N7002BKM/V,315

NEXPERIA 2N7002BKM - SMALL SIGNA
part number has RoHS
Manufacturer # :2N7002BKM/V,315
Manufacturer :Rochester Electronics
Dasenic # :2N7002BKM/V,315-DS
Customer # :
Description : NEXPERIA 2N7002BKM - SMALL SIGNA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 2432
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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Payment :
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2N7002BKM/V,315 information

  • Rochester Electronics 2N7002BKM/V,315 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Technology:-
  • Supplier Device Package:-
  • Power Dissipation ( Max):-
  • F E T Type:-
  • F E T Feature:-
  • Drain to Source Voltage ( Vdss):-
  • Current - Continuous Drain ( Id) @ 25° C:-
  • Rds On ( Max) @ Id, Vgs:-
  • Vgs(th) ( Max) @ Id:-
  • Gate Charge ( Qg) ( Max) @ Vgs:-
  • Input Capacitance ( Ciss) ( Max) @ Vds:-
  • Drive Voltage ( Max Rds On, Min Rds On):-
  • Vgs ( Max):-
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • EU RoHS Status:RoHS Compliant
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
2N7002BKM/V,315 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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