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Rochester Electronics 27HC256L-90/J
Manufacturer # :27HC256L-90/J
Manufacturer :Rochester Electronics
Dasenic # :27HC256L-90/J-DS
Datasheet : 27HC256L-90/J Datasheet
Customer # :
Description : 256K (32K X 8) CMOS EPROM
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 8715
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.726
Total :$ 3.73
Delivery :
Payment :
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27HC256L-90/J information
Rochester Electronics 27HC256L-90/J technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:28-CDIP (0.300", 7.62mm) Window
- Technology:EPROM - UV
- Supplier Device Package:28-CERDIP
- Memory Size:256Kb (32K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:-
- Access Time:90 ns
- Memory Format:EPROM
- Memory Interface:Parallel
- Write Cycle Time - Word, Page:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8542.32.0071
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
27HC256L-90/J provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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