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Rochester Electronics 25PPC405GP-3BC200C

IBM25PPC405 - POWERPC 405GP
part number has RoHS
Manufacturer # :25PPC405GP-3BC200C
Manufacturer :Rochester Electronics
Dasenic # :25PPC405GP-3BC200C-DS
Customer # :
Description : IBM25PPC405 - POWERPC 405GP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 41.2110$ 41.21
25+$ 40.3830$ 1009.58
100+$ 38.7360$ 3873.6
500+$ 37.0890$ 18544.5
1000+$ 35.0280$ 35028
In Stock: 8619
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 41.211
Total :$ 41.21
Delivery :
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Payment :
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25PPC405GP-3BC200C information

  • Rochester Electronics 25PPC405GP-3BC200C technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TC)
  • Package / Case:456-BBGA
  • Supplier Device Package:456-EPBGA (35x35)
  • Voltage - I/ O:3.3V
  • Speed:200MHz
  • Core Processor:PowerPC 405
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:-
  • R A M Controllers:SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100Mbps (1)
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
25PPC405GP-3BC200C provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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