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Rochester Electronics 25EMPPC603E2BB200F

IBM25EMPPC603 - POWERPC 603E
part number has RoHS
Manufacturer # :25EMPPC603E2BB200F
Manufacturer :Rochester Electronics
Dasenic # :25EMPPC603E2BB200F-DS
Customer # :
Description : IBM25EMPPC603 - POWERPC 603E
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 27.4950$ 27.5
25+$ 26.9460$ 673.65
100+$ 25.8480$ 2584.8
500+$ 24.7500$ 12375
1000+$ 23.3730$ 23373
In Stock: 6449
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 27.495
Total :$ 27.50
Delivery :
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Payment :
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25EMPPC603E2BB200F information

  • Rochester Electronics 25EMPPC603E2BB200F technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microprocessors
  • Product Status:Active
  • Operating Temperature:0°C ~ 105°C (TJ)
  • Package / Case:278-BBGA, FCBGA
  • Supplier Device Package:278-FCPBGA (21x21)
  • Voltage - I/ O:2.5V, 3.3V
  • Speed:200MHz
  • Core Processor:PowerPC EM603e
  • Number of Cores/ Bus Width:1 Core, 32-Bit
  • Co- Processors/ D S P:-
  • R A M Controllers:-
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:-
  • S A T A:-
  • U S B:-
  • Security Features:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
25EMPPC603E2BB200F provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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