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Rochester Electronics 100324PC

TTL TO ECL TRANSLATOR
part number has RoHS
Manufacturer # :100324PC
Manufacturer :Rochester Electronics
Dasenic # :100324PC-DS
Customer # :
Description : TTL TO ECL TRANSLATOR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.1230$ 3.12
25+$ 3.0600$ 76.5
100+$ 2.9340$ 293.4
500+$ 2.8080$ 1404
1000+$ 2.6550$ 2655
In Stock: 9042
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.123
Total :$ 3.12
Delivery :
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Payment :
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100324PC information

  • Rochester Electronics 100324PC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Translators, Level Shifters
  • Product Status:Active
  • Operating Temperature:0°C ~ 85°C (TC)
  • Features:-
  • Mounting Type:Through Hole
  • Package / Case:24-DIP (0.400", 10.16mm)
  • Output Type:Differential
  • Supplier Device Package:24-PDIP
  • Number of Circuits:1
  • Data Rate:-
  • Input Signal:TTL
  • Output Signal:ECL
  • Translator Type:Mixed Signal
  • Channel Type:Unidirectional
  • Channels per Circuit:6
  • Voltage - V C C A:-
  • Voltage - V C C B:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
100324PC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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