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Rochester Electronics R1LV5256ESA-5SR#S0

IC SRAM 256KBIT PARALLEL 28TSOP
part number has RoHS
Manufacturer # :R1LV5256ESA-5SR#S0
Manufacturer :Rochester Electronics
Dasenic # :R1LV5256ESA-5SR#S0-DS
Customer # :
Description : IC SRAM 256KBIT PARALLEL 28TSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0090$ 0.01
10+$ 0.0090$ 0.09
100+$ 0.0090$ 0.9
500+$ 0.0090$ 4.5
1000+$ 0.0090$ 9
In Stock: 52349
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
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R1LV5256ESA-5SR#S0 information

  • Rochester Electronics R1LV5256ESA-5SR#S0 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:28-TSSOP (0.465", 11.80mm Width)
  • Technology:SRAM
  • Supplier Device Package:28-TSOP
  • Memory Size:256Kb (32K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:-
  • Access Time:55 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:55ns
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
R1LV5256ESA-5SR#S0 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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