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1 : $0.9360
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Rochester Electronics QS32XVH384Q1G
IC BUS SWITCH 2 X 10:10 48QSOP
Manufacturer # :QS32XVH384Q1G
Manufacturer :Rochester Electronics
Dasenic # :QS32XVH384Q1G-DS
Datasheet :
QS32XVH384Q1G Datasheet
QS32XVH384Q1G DatasheetCustomer # :
Description : IC BUS SWITCH 2 X 10:10 48QSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.9360 | $ 0.94 |
| 25+ | $ 0.9180 | $ 22.95 |
| 100+ | $ 0.8798 | $ 87.98 |
| 500+ | $ 0.8424 | $ 421.2 |
| 1000+ | $ 0.7956 | $ 795.6 |
In Stock: 8637
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.936
Total :$ 0.94
Delivery :
Payment :
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QS32XVH384Q1G information
Rochester Electronics QS32XVH384Q1G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:48-FSOP (0.154", 3.90mm Width)
- Type:Bus Switch
- Supplier Device Package:48-QVSOP
- Voltage - Supply:2.3V ~ 3.6V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:2 x 10:10
- Independent Circuits:2
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
QS32XVH384Q1G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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