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Rochester Electronics ISL6141CB

POWER SUPPLY CIRCUIT, ADJ
part number has RoHS
Manufacturer # :ISL6141CB
Manufacturer :Rochester Electronics
Dasenic # :ISL6141CB-DS
Customer # :
Description : POWER SUPPLY CIRCUIT, ADJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3230$ 1.32
25+$ 1.2960$ 32.4
100+$ 1.2420$ 124.2
500+$ 1.1880$ 594
1000+$ 1.1250$ 1125
In Stock: 14559
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.323
Total :$ 1.32
Delivery :
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Payment :
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ISL6141CB information

  • Rochester Electronics ISL6141CB technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Features:Auto Retry, Fault Timeout
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Supply:2.4 mA
  • Type:Hot Swap Controller
  • Number of Channels:1
  • Supplier Device Package:8-SOIC
  • Internal Switch(s):No
  • Voltage - Supply:20V ~ 80V
  • Programmable Features:Current Limit, OVP, UVLO
  • Current - Output ( Max):-
  • Applications:-48V, VoIP
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISL6141CB provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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