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Rochester Electronics ISL6116CBZA-T

POWER SUPPLY CIRCUIT, ADJ
part number has RoHS
Manufacturer # :ISL6116CBZA-T
Manufacturer :Rochester Electronics
Dasenic # :ISL6116CBZA-T-DS
Customer # :
Description : POWER SUPPLY CIRCUIT, ADJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.5920$ 2.59
25+$ 2.5380$ 63.45
100+$ 2.4390$ 243.9
500+$ 2.3310$ 1165.5
1000+$ 2.2050$ 2205
In Stock: 30000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.592
Total :$ 2.59
Delivery :
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Payment :
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ISL6116CBZA-T information

  • Rochester Electronics ISL6116CBZA-T technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 85°C
  • Features:Latched Fault
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Current - Supply:3 mA
  • Type:Hot Swap Controller
  • Number of Channels:1
  • Supplier Device Package:8-SOIC
  • Internal Switch(s):No
  • Voltage - Supply:9V ~ 15V
  • Programmable Features:Current Limit, Fault Timeout
  • Current - Output ( Max):-
  • Applications:General Purpose
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ISL6116CBZA-T provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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