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Rochester Electronics ICL3232EIA-T
IC TRANSCEIVER FULL 2/2 16SSOP
Manufacturer # :ICL3232EIA-T
Manufacturer :Rochester Electronics
Dasenic # :ICL3232EIA-T-DS
Datasheet :
ICL3232EIA-T Datasheet
ICL3232EIA-T DatasheetCustomer # :
Description : IC TRANSCEIVER FULL 2/2 16SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 15.4541 | $ 15.45 |
| 25+ | $ 15.1583 | $ 378.96 |
| 100+ | $ 14.5668 | $ 1456.68 |
| 500+ | $ 13.9013 | $ 6950.65 |
| 1000+ | $ 13.1619 | $ 13161.9 |
In Stock: 8309
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 15.4541
Total :$ 15.45
Delivery :
Payment :
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ICL3232EIA-T information
Rochester Electronics ICL3232EIA-T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:16-SSOP (0.209", 5.30mm Width)
- Type:Transceiver
- Supplier Device Package:16-SSOP
- Voltage - Supply:3V ~ 5.5V
- Protocol:RS232
- Number of Drivers/ Receivers:2/2
- Duplex:Full
- Receiver Hysteresis:500 mV
- Data Rate:250kbps
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ICL3232EIA-T provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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