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Rochester Electronics HIP1011ACB
Manufacturer # :HIP1011ACB
Manufacturer :Rochester Electronics
Dasenic # :HIP1011ACB-DS
Datasheet : HIP1011ACB Datasheet
Customer # :
Description : POWER SUPPLY CIRCUIT, ADJ
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4626
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.933
Total :$ 3.93
Delivery :
Payment :
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HIP1011ACB information
Rochester Electronics HIP1011ACB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Hot Swap Controllers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Features:Latched Fault, UVLO
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Current - Supply:5 mA
- Type:Hot Plug Controller
- Number of Channels:4
- Supplier Device Package:16-SOIC
- Internal Switch(s):Both
- Voltage - Supply:10.8V ~ 13.2V
- Programmable Features:Circuit Breaker, Fault Timeout, Slew Rate
- Current - Output ( Max):100mA, 500mA
- Applications:CompactPCI™
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HIP1011ACB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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