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1 : $0.5753
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Rochester Electronics HIN202CBN-T
IC TRANSCEIVER FULL 2/2 16SOIC
Manufacturer # :HIN202CBN-T
Manufacturer :Rochester Electronics
Dasenic # :HIN202CBN-T-DS
Datasheet :
HIN202CBN-T Datasheet
HIN202CBN-T DatasheetCustomer # :
Description : IC TRANSCEIVER FULL 2/2 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.5753 | $ 0.58 |
| 25+ | $ 0.5638 | $ 14.1 |
| 100+ | $ 0.5407 | $ 54.07 |
| 500+ | $ 0.5178 | $ 258.9 |
| 1000+ | $ 0.4890 | $ 489 |
In Stock: 3132
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5753
Total :$ 0.58
Delivery :
Payment :
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HIN202CBN-T information
Rochester Electronics HIN202CBN-T technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Drivers, Receivers, Transceivers
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.154", 3.90mm Width)
- Type:Transceiver
- Supplier Device Package:16-SOIC
- Voltage - Supply:4.5V ~ 5.5V
- Protocol:RS232
- Number of Drivers/ Receivers:2/2
- Duplex:Full
- Receiver Hysteresis:500 mV
- Data Rate:120Kbps
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HIN202CBN-T provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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