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Rochester Electronics HI5760IA
Manufacturer # :HI5760IA
Manufacturer :Rochester Electronics
Dasenic # :HI5760IA-DS
Datasheet : HI5760IA Datasheet
Customer # :
Description : DAC, PARALLEL, WORD INPUT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1828
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.741
Total :$ 6.74
Delivery :
Payment :
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HI5760IA information
Rochester Electronics HI5760IA technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital to Analog Converters (DAC)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:28-TSSOP (0.173", 4.40mm Width)
- Output Type:Current - Unbuffered
- Supplier Device Package:28-TSSOP
- Data Interface:Parallel
- Number of Bits:10
- Voltage - Supply, Analog:2.7V ~ 5.5V
- Voltage - Supply, Digital:2.7V ~ 5.5V
- Architecture:Current Source
- Reference Type:External, Internal
- Number of D/ A Converters:1
- Settling Time:35ns (Typ)
- Differential Output:Yes
- I N L/ D N L ( L S B):±0.5, ±0.25
- EU RoHS Status:RoHS non-compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
HI5760IA provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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