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Rochester Electronics EL5246CSZ-T7
IC OPAMP VFB 2 CIRCUIT 14SOIC
Manufacturer # :EL5246CSZ-T7
Manufacturer :Rochester Electronics
Dasenic # :EL5246CSZ-T7-DS
Datasheet :
EL5246CSZ-T7 Datasheet
EL5246CSZ-T7 DatasheetCustomer # :
Description : IC OPAMP VFB 2 CIRCUIT 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5560 | $ 2.56 |
| 25+ | $ 2.5020 | $ 62.55 |
| 100+ | $ 2.4030 | $ 240.3 |
| 500+ | $ 2.3040 | $ 1152 |
| 1000+ | $ 2.1690 | $ 2169 |
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.556
Total :$ 2.56
Delivery :
Payment :
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EL5246CSZ-T7 information
Rochester Electronics EL5246CSZ-T7 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:7mA (x2 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:14-SOIC
- Number of Circuits:2
- Amplifier Type:Voltage Feedback
- -3db Bandwidth:100 MHz
- Current - Output / Channel:120 mA
- Slew Rate:200V/µs
- Gain Bandwidth Product:60 MHz
- Current - Input Bias:2 nA
- Voltage - Input Offset:25 mV
- Voltage - Supply Span ( Min):4.75 V
- Voltage - Supply Span ( Max):5.25 V
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.33.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EL5246CSZ-T7 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
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Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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