Name: 54FCT573TDB
Brand: Rochester Electronics
SKU: DS-5931185
Price: 6.012 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Rochester Electronics 54FCT573TDB

54FCT573 - FAST CMOS OCTAL TRANS

Manufacturer # :54FCT573TDB

Manufacturer :Rochester Electronics

Dasenic # :54FCT573TDB-DS

Datasheet :

54FCT573TDB Datasheet

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Description : 54FCT573 - FAST CMOS OCTAL TRANS

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Quantity	Unit Price	Total
1+	$ 6.0120	$ 6.01
10+	$ 5.7715	$ 57.72
100+	$ 5.4108	$ 541.08
1000+	$ 5.3507	$ 5350.7
10000+	$ 5.2906	$ 52906

In Stock: 45902

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 6.012

Total :$ 6.01

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54FCT573TDB information

Rochester Electronics 54FCT573TDB technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Logic - Latches
Product Status:Active
Operating Temperature:-55°C ~ 125°C
Mounting Type:Through Hole
Package / Case:20-CDIP (0.300", 7.62mm)
Output Type:Tri-State
Supplier Device Package:20-CDIP
Voltage - Supply:4.5V ~ 5.5V
Logic Type:D-Type Transparent Latch
Current - Output High, Low:-
Circuit:8:8
Independent Circuits:1
Delay Time - Propagation:15ns
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Rochester Electronics 54FCT573TDB
Datasheet:
54FCT573TDB,

Rochester Electronics 54FCT573TDB Environmental and export classification status description
The Renesas Electronics 54FCT573TDB is an octal D-type transparent latch with 3-state outputs. It is a part of the 54FCT series of integrated circuits, which offer high-speed performance and low power consumption. Functions: The main function of the 54FCT573TDB is to store data temporarily (latch) and allow for the data to be transparently passed through when enabled. Applications: - Data storage in digital systems - Parallel data transfer - Memory interfacing - Address and data bus buffering Alternative Components: - Texas Instruments SN74F373 - Fairchild Semiconductor 74ACT273 - NXP Semiconductors 74LVC573A Embedded Modules: The 54FCT573TDB can be integrated into larger systems such as: - Microcontrollers - FPGAs - System-on-Chip (SoC) designs Related Q&A: 1. What is the maximum operating frequency of the 54FCT573TDB latch? - The maximum operating frequency is typically in the range of several tens to hundreds of MHz, depending on the specific conditions and setup. 2. How does the 3-state output feature of the 54FCT573TDB benefit system design? - The 3-state output allows the device to be disconnected from the data bus when not actively driving or receiving data, preventing bus contention and improving system reliability. 3. Can multiple 54FCT573TDB latches be cascaded together for larger data widths? - Yes, multiple latches can be connected in parallel, enabling the creation of wider data storage structures in digital systems. 4. What is the power consumption of the 54FCT573TDB in typical operation? - The power consumption of the device is relatively low, making it suitable for battery-powered applications and energy-efficient designs. 5. What precautions should be taken when interfacing the 54FCT573TDB with other components in a system? - Proper signal voltage levels and timing compatibility should be ensured to prevent damage and ensure reliable operation. Pull-up or pull-down resistors may be necessary in some configurations.

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54FCT573TDB provided by Rochester Electronics

As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.