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Plastronics H038DL3A-1C

SPRING PROBE .38X3.86MM 1=100PCS
part number has RoHS
Manufacturer # :H038DL3A-1C
Manufacturer :Plastronics
Dasenic # :H038DL3A-1C-DS
Customer # :
Description : SPRING PROBE .38X3.86MM 1=100PCS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 1015
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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H038DL3A-1C information

  • Plastronics H038DL3A-1C technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Contacts, Spring Loaded (Pogo Pins), and Pressure
  • Product Status:Active
  • Features:-
  • Mounting Type:Surface Mount
  • Contact Finish:Gold
  • Contact Finish Thickness:-
  • Contact Material:Beryllium Copper
  • Contact Type:Probe Pin
  • Mating Cycles:125000
  • Maximum Working Height:-
  • Minimum Working Height:-
  • Operating Force - Initial:-
  • Operating Force - Mid Compression:-
  • Pad Layout Dimension:-
  • Plunger Size:0.080" ~ 0.230" (2.03mm ~ 5.84mm)
  • Recommended Working Height:0.135" (3.44mm)
H038DL3A-1C provided by Plastronics
Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our team invented the first open-top socket for production burn-in of LCC and PLCC packages to help semiconductor manufacturers significantly increase their throughput and decrease costs. Now, Plastronics offers complete, reliable burn-in test socket solutions for all the latest packaged devices. We have the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA and BGA devices.
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