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Plastronics H038LL3A-1C
SPRING PROBE .38MM X 2.95MM HPIN
Manufacturer # :H038LL3A-1C
Manufacturer :Plastronics
Dasenic # :H038LL3A-1C-DS
Datasheet :
H038LL3A-1C Datasheet
H038LL3A-1C DatasheetCustomer # :
Description : SPRING PROBE .38MM X 2.95MM HPIN
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| Quantity | Unit Price | Total |
In Stock: 4398
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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H038LL3A-1C information
Plastronics H038LL3A-1C technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Contacts, Spring Loaded (Pogo Pins), and Pressure
- Product Status:Active
- Features:-
- Mounting Type:Surface Mount
- Contact Finish:Gold
- Contact Finish Thickness:-
- Contact Material:Beryllium Copper
- Contact Type:Probe Pin
- Mating Cycles:125000
- Maximum Working Height:-
- Minimum Working Height:-
- Operating Force - Initial:-
- Operating Force - Mid Compression:-
- Pad Layout Dimension:-
- Plunger Size:0.080" ~ 0.230" (2.03mm ~ 5.84mm)
- Recommended Working Height:0.099" (2.52mm)
H038LL3A-1C provided by Plastronics
Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our team invented the first open-top socket for production burn-in of LCC and PLCC packages to help semiconductor manufacturers significantly increase their throughput and decrease costs.
Now, Plastronics offers complete, reliable burn-in test socket solutions for all the latest packaged devices. We have the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA and BGA devices.
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