Name: H033DL2A-1C
Brand: Plastronics
SKU: DS-4321530
Availability: InStock
Rating: 4.8 (3 reviews)

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Plastronics H033DL2A-1C

SPRING PROBE .33MM X 3.81MM HPIN

Manufacturer # :H033DL2A-1C

Manufacturer :Plastronics

Dasenic # :H033DL2A-1C-DS

Datasheet :

H033DL2A-1C Datasheet

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Description : SPRING PROBE .33MM X 3.81MM HPIN

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In Stock: 4361

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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H033DL2A-1C information

Plastronics H033DL2A-1C technical specifications, attributes, parameters.
Category:Connectors & Interconnects/Contacts, Spring Loaded (Pogo Pins), and Pressure
Product Status:Active
Features:-
Mounting Type:Surface Mount
Contact Finish:Gold
Contact Finish Thickness:-
Contact Material:Beryllium Copper
Contact Type:Probe Pin
Mating Cycles:125000
Maximum Working Height:-
Minimum Working Height:-
Operating Force - Initial:-
Operating Force - Mid Compression:-
Pad Layout Dimension:-
Plunger Size:0.080" ~ 0.120" (2.03mm ~ 3.05mm)
Recommended Working Height:0.134" (3.41mm)

Download datasheets and manufacturer documentation for Plastronics H033DL2A-1C
Datasheet:
H033DL2A-1C,

Plastronics H033DL2A-1C Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

H033DL2A-1C provided by Plastronics

Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our team invented the first open-top socket for production burn-in of LCC and PLCC packages to help semiconductor manufacturers significantly increase their throughput and decrease costs. Now, Plastronics offers complete, reliable burn-in test socket solutions for all the latest packaged devices. We have the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA and BGA devices.