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  • Plastronics H033DL2A-1C

    SPRING PROBE .33MM X 3.81MM HPIN
  • part number has RoHS
  • Mfr.Part # :H033DL2A-1C
  • Manufacturer :Plastronics
  • Dasenic # :H033DL2A-1C-DS
  • Datasheet :pdf download H033DL2A-1C Datasheet
  • Description : SPRING PROBE .33MM X 3.81MM HPIN
  • Package :-
  • Quantity :
    Unit Price : $ 0Total : $ 0.00
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 4361
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
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Plastronics H033DL2A-1C technical specifications, attributes, parameters.
Category:Connectors & Interconnects/Contacts, Spring Loaded (Pogo Pins), and Pressure
Product Status:Active
Features:-
Mounting Type:Surface Mount
Contact Finish:Gold
Contact Finish Thickness:-
Contact Material:Beryllium Copper
Contact Type:Probe Pin
Mating Cycles:125000
Maximum Working Height:-
Minimum Working Height:-
Operating Force - Initial:-
Operating Force - Mid Compression:-
Pad Layout Dimension:-
Plunger Size:0.080" ~ 0.120" (2.03mm ~ 3.05mm)
Recommended Working Height:0.134" (3.41mm)
H033DL2A-1C provided by Plastronics
Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry’s burn-in socket needs for more than 40 years. It all started when our team invented the first open-top socket for production burn-in of LCC and PLCC packages to help semiconductor manufacturers significantly increase their throughput and decrease costs. Now, Plastronics offers complete, reliable burn-in test socket solutions for all the latest packaged devices. We have the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA and BGA devices.
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