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1 : $2.5020
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Onsemi OPB861T55
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Manufacturer # :OPB861T55
Manufacturer :Onsemi
Dasenic # :OPB861T55-DS
Datasheet :
OPB861T55 Datasheet
OPB861T55 DatasheetCustomer # :
Description : SWITCH IR PHOTO TRANS OUT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.5020 | $ 2.5 |
| 100+ | $ 2.3310 | $ 233.1 |
| 250+ | $ 2.5020 | $ 625.5 |
| 500+ | $ 2.1600 | $ 1080 |
| 1000+ | $ 2.0790 | $ 2079 |
In Stock: 4812
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.502
Total :$ 2.50
Delivery :
Payment :
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OPB861T55 information
Onsemi OPB861T55 technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Ambient Light, IR, UV Sensors
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Through Hole
- Package / Case:Module, PC Pins, Slot Type
- Type:-
- Output Type:-
- Supplier Device Package:-
- Voltage - Supply:-
- Proximity Detection:-
- Wavelength:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
OPB861T55 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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