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Rochester Electronics TIP107TU

TRANS PNP DARL 100V 8A TO220-3
part number has RoHS
Manufacturer # :TIP107TU
Manufacturer :Rochester Electronics
Dasenic # :TIP107TU-DS
Customer # :
Description : TRANS PNP DARL 100V 8A TO220-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.1400$ 2.14
50+$ 1.7720$ 88.6
100+$ 1.4040$ 140.4
500+$ 1.1880$ 594
1000+$ 1.0180$ 1018
In Stock: 2694
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.14
Total :$ 2.14
Delivery :
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Payment :
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TIP107TU information

  • Rochester Electronics TIP107TU technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
  • Product Status:Active
  • Operating Temperature:150°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Power - Max:2 W
  • Supplier Device Package:TO-220-3
  • Transistor Type:PNP - Darlington
  • Current - Collector ( Ic) ( Max):8 A
  • Voltage - Collector Emitter Breakdown ( Max):100 V
  • Vce Saturation ( Max) @ Ib, Ic:2.5V @ 80mA, 8A
  • Current - Collector Cutoff ( Max):50µA
  • D C Current Gain (h F E) ( Min) @ Ic, Vce:1000 @ 3A, 4V
  • Frequency - Transition:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TIP107TU provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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