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  • Rochester Electronics QTLP321CR

    LED RED 4DIP THROUGH HOLE
  • part number has RoHS
  • Mfr.Part # :QTLP321CR
  • Manufacturer :Rochester Electronics
  • Dasenic # :QTLP321CR-DS
  • Datasheet :pdf download QTLP321CR Datasheet
  • Description : LED RED 4DIP THROUGH HOLE
  • Package :-
  • Quantity :
    Unit Price : $ 0.234Total : $ 0.23
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 6480
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.2340$ 0.23
25 +$ 0.2293$ 5.73
100 +$ 0.2200$ 22.00
500 +$ 0.2106$ 105.30
1000 +$ 0.1989$ 198.90

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Rochester Electronics QTLP321CR technical specifications, attributes, parameters.
Category:Optoelectronics Devices/LED Indication - Discrete
Product Status:Obsolete
Color:Red
Features:-
Mounting Type:Through Hole
Package / Case:4-DIP (0.200", 5.08mm)
Size / Dimension:7.62mm L x 7.62mm W
Height ( Max):6.50mm
Supplier Device Package:POWER LED
Configuration:Standard
Current - Test:70mA
Voltage - Forward ( Vf) ( Typ):2.2V
Millicandela Rating:-
Wavelength - Peak:640nm
Viewing Angle:50°
Lens Color:-
Lens Transparency:-
Lens Style:Round with Domed Top
Lens Size:3.00mm Dia
Wavelength - Dominant:630nm
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
QTLP321CR provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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