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Onsemi NVG800A75L4DSC-Z008
DUAL SIDE COOLING POWER MODULE
Manufacturer # :NVG800A75L4DSC-Z008
Manufacturer :Onsemi
Dasenic # :NVG800A75L4DSC-Z008-DS
Datasheet :
NVG800A75L4DSC-Z008 Datasheet
NVG800A75L4DSC-Z008 DatasheetCustomer # :
Description : DUAL SIDE COOLING POWER MODULE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 6+ | $ 236.2500 | $ 1417.5 |
In Stock: 2862
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 236.25
Total :$ 236.25
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Payment :
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NVG800A75L4DSC-Z008 information
Onsemi NVG800A75L4DSC-Z008 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Power Driver Modules
- Product Status:Active
- Mounting Type:Chassis Mount
- Package / Case:Module
- Type:IGBT
- Configuration:Half Bridge
- Voltage:750 V
- Current:800 A
- Voltage - Isolation:4200Vrms
- EU RoHS Status:ROHS3 Compliant
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
NVG800A75L4DSC-Z008 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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