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Onsemi FSBB30CH60C

MODULE SPM 600KV 30A 27PWRDIP
part number has RoHS
Manufacturer # :FSBB30CH60C
Manufacturer :Onsemi
Dasenic # :FSBB30CH60C-DS
Customer # :
Description : MODULE SPM 600KV 30A 27PWRDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
3+$ 20.9379$ 62.81
6+$ 17.1798$ 103.08
9+$ 16.6430$ 149.79
12+$ 16.1061$ 193.27
15+$ 15.5692$ 233.54
In Stock: 5289
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 20.9379
Total :$ 20.94
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FSBB30CH60C information

  • Onsemi FSBB30CH60C technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Not For New Designs
  • Mounting Type:Through Hole
  • Package / Case:27-PowerDIP Module (1.205", 30.60mm)
  • Type:IGBT
  • Configuration:3 Phase
  • Voltage:600 V
  • Current:30 A
  • Voltage - Isolation:2500Vrms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FSBB30CH60C provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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