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Onsemi NSPU5221MUTBG
Manufacturer # :NSPU5221MUTBG
Manufacturer :Onsemi
Dasenic # :NSPU5221MUTBG-DS
Datasheet : NSPU5221MUTBG Datasheet
Customer # :
Description : TVS DIODE 22VWM 35VC 6UDFN 6-UFDFN Exposed Pad
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 27626
MOQ :1 PCS
Packaging :6-UFDFN Exposed Pad
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1085
Total :$ 0.11
Delivery :
Payment :
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NSPU5221MUTBG information
Onsemi NSPU5221MUTBG technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:6-UFDFN Exposed Pad
- Type:Zener
- Capacitance @ Frequency:-
- Supplier Device Package:6-UDFN (1.8x2)
- Unidirectional Channels:1
- Voltage - Reverse Standoff ( Typ):22V
- Voltage - Breakdown ( Min):24V
- Voltage - Clamping ( Max) @ Ipp:35V
- Current - Peak Pulse (10/1000µs):120A (8/20µs)
- Power - Peak Pulse:-
- Power Line Protection:No
- Bidirectional Channels:-
- Applications:General Purpose
NSPU5221MUTBG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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