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Onsemi NSPM5131MUTBG
Manufacturer # :NSPM5131MUTBG
Manufacturer :Onsemi
Dasenic # :NSPM5131MUTBG-DS
Datasheet : NSPM5131MUTBG Datasheet
Customer # :
Description : TVS DIODE 13.5VWM 21.5VC 6UDFN 6-UFDFN Exposed Pad
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 11549
MOQ :1 PCS
Packaging :6-UFDFN Exposed Pad
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1666
Total :$ 0.17
Delivery :
Payment :
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NSPM5131MUTBG information
Onsemi NSPM5131MUTBG technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:6-UFDFN Exposed Pad
- Type:Zener
- Capacitance @ Frequency:-
- Supplier Device Package:6-UDFN (1.8x2)
- Unidirectional Channels:1
- Voltage - Reverse Standoff ( Typ):13.5V (Max)
- Voltage - Breakdown ( Min):13.6V
- Voltage - Clamping ( Max) @ Ipp:21.5V
- Current - Peak Pulse (10/1000µs):160A (8/20µs)
- Power - Peak Pulse:-
- Power Line Protection:No
- Bidirectional Channels:-
- Applications:General Purpose
NSPM5131MUTBG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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