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Onsemi NOIP1SE016KA-GTI
IC IMAGE SENSOR 16K 355CPGA
Manufacturer # :NOIP1SE016KA-GTI
Manufacturer :Onsemi
Dasenic # :NOIP1SE016KA-GTI-DS
Datasheet :
NOIP1SE016KA-GTI Datasheet
NOIP1SE016KA-GTI DatasheetCustomer # :
Description : IC IMAGE SENSOR 16K 355CPGA
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| Quantity | Unit Price | Total |
| 10+ | $ 4746.3800 | $ 47463.8 |
| 25+ | $ 4473.2200 | $ 111830.5 |
In Stock: 2614
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4746.38
Total :$ 4746.38
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NOIP1SE016KA-GTI information
Onsemi NOIP1SE016KA-GTI technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TJ)
- Package / Case:355-BSPGA, Window
- Type:CMOS
- Supplier Device Package:355-µPGA
- Voltage - Supply:1.7V ~ 1.9V, 3.2V ~ 3.4V
- Frames per Second:120
- Pixel Size:4.5µm x 4.5µm
- Active Pixel Array:4096H x 4096V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NOIP1SE016KA-GTI provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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