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Onsemi NFAQ1060L33T

MOD IPM INV 600V 10A 38DIP
part number has RoHS
Manufacturer # :NFAQ1060L33T
Manufacturer :Onsemi
Dasenic # :NFAQ1060L33T-DS
Customer # :
Description : MOD IPM INV 600V 10A 38DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.6830$ 10.68
10+$ 9.4410$ 94.41
25+$ 9.3960$ 234.9
50+$ 9.3780$ 468.9
100+$ 9.3420$ 934.2
In Stock: 3294
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.683
Total :$ 10.68
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NFAQ1060L33T information

  • Onsemi NFAQ1060L33T technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Active
  • Mounting Type:Through Hole
  • Package / Case:38-PowerDIP Module (0.610", 24.00mm), 24 Leads
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Voltage:600 V
  • Current:10 A
  • Voltage - Isolation:2000Vrms
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NFAQ1060L33T provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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