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Rochester Electronics NCV2250SN2T3G

NCV2250 - NCV2250 - COMPARATOR G
part number has RoHS
Manufacturer # :NCV2250SN2T3G
Manufacturer :Rochester Electronics
Dasenic # :NCV2250SN2T3G-DS
Customer # :
Description : NCV2250 - NCV2250 - COMPARATOR G
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.9139$ 9.14
3000+$ 0.5077$ 1523.1
6000+$ 0.4664$ 2798.4
9000+$ 0.5077$ 4569.3
15000+$ 0.4219$ 6328.5
In Stock: 1503
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.9139
Total :$ 0.91
Delivery :
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Payment :
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NCV2250SN2T3G information

  • Rochester Electronics NCV2250SN2T3G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Comparators
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Type:-
  • Output Type:-
  • Supplier Device Package:-
  • Number of Elements:-
  • Voltage - Supply, Single/ Dual (±):-
  • Voltage - Input Offset ( Max):-
  • Current - Input Bias ( Max):-
  • Current - Output ( Typ):-
  • Current - Quiescent ( Max):-
  • C M R R, P S R R ( Typ):-
  • Propagation Delay ( Max):-
  • Hysteresis:-
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • EU RoHS Status:RoHS Compliant
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NCV2250SN2T3G provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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