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Rochester Electronics MOC3021VM

Name: MOC3021VM
Brand: Rochester Electronics
SKU: MOC3021VM-DS
Price: 0.8190 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 4389

MOQ: 1

5 Price Tiers

Mfr.Part # :MOC3021VM
Manufacturer :Rochester Electronics
Dasenic # :MOC3021VM-DS
Datasheet : MOC3021VM Datasheet PDF
Description : TRIAC OUTPUT OPTOCOUPLER, 5300V
Package :-
Unit Price: $0.8190
Total: $0.82

Quantity	Unit Price	You Save
1-1	$0.8190	-
2-10	$0.5013	38.8% save
11-100	$0.3384	58.7% save
101-500	$0.2502	69.5% save
501-1000	$0.2358	71.2% save

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Rochester Electronics MOC3021VM technical specifications, attributes, parameters.

Category:Isolators/Optoisolators - Triac, SCR Output

Product Status:Active

Operating Temperature:-40°C ~ 85°C

Mounting Type:Through Hole

Package / Case:6-DIP (0.300", 7.62mm)

Approval Agency:IEC/EN/DIN, UL

Output Type:Triac

Number of Channels:1

Supplier Device Package:6-DIP

Voltage - Off State:400 V

Current - Hold ( Ih):100µA (Typ)

Voltage - Isolation:4170Vrms

Current - On State ( It ( R M S)) ( Max):-

Voltage - Forward ( Vf) ( Typ):1.15V

Current - D C Forward ( If) ( Max):60 mA

Zero Crossing Circuit:No

Static d V/dt ( Min):-

Current - L E D Trigger ( Ift) ( Max):15mA

Turn On Time:-

EU RoHS Status:ROHS3 Compliant

MSL Rating:Vendor omitted MSL Rating information

REACH Status:REACH Unaffected

US ECCN:EAR99

HTS US:8541.49.8000

China RoHS Status:Green Symbol: Green and environmentally friendly product

MOC3021VM provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.