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Onsemi MC100EP116FAR2

IC TCVR/DRVR HEX DIFF ECL 32LQFP
part number has RoHS
Manufacturer # :MC100EP116FAR2
Manufacturer :Onsemi
Dasenic # :MC100EP116FAR2-DS
Customer # :
Description : IC TCVR/DRVR HEX DIFF ECL 32LQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.0030$ 6
25+$ 5.8860$ 147.15
100+$ 5.6430$ 564.3
500+$ 5.4000$ 2700
1000+$ 5.1030$ 5103
In Stock: 7200
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.003
Total :$ 6.00
Delivery :
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MC100EP116FAR2 information

  • Onsemi MC100EP116FAR2 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:32-LQFP
  • Supplier Device Package:32-LQFP (7x7)
  • Supply Voltage:3V ~ 5.5V
  • Number of Bits:-
  • Logic Type:Differential Receiver/Driver
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC100EP116FAR2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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