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  • Rochester Electronics LV8082LP-TE-L-H

    H-BRIDGE DRIVER IC
  • part number has RoHS
  • Mfr.Part # :LV8082LP-TE-L-H
  • Manufacturer :Rochester Electronics
  • Dasenic # :LV8082LP-TE-L-H-DS
  • Datasheet :pdf download LV8082LP-TE-L-H Datasheet
  • Description : H-BRIDGE DRIVER IC
  • Package :-
  • Quantity :
    Unit Price : $ 1.053Total : $ 1.05
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 33600
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 1.0530$ 1.05
25 +$ 1.0350$ 25.88
100 +$ 0.9900$ 99.00
500 +$ 0.9450$ 472.50
1000 +$ 0.8951$ 895.10

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Rochester Electronics LV8082LP-TE-L-H technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Motor Drivers, Controllers
Product Status:Obsolete
Operating Temperature:-30°C ~ 85°C (TA)
Mounting Type:Surface Mount
Package / Case:16-WFQFN
Technology:Bi-CMOS
Interface:Parallel
Supplier Device Package:16-VCT (2.6x2.6)
Voltage - Supply:2.5V ~ 6V
Current - Output:200mA
Output Configuration:Half Bridge (4)
Voltage - Load:2.5V ~ 6V
Motor Type - Stepper:-
Motor Type - A C, D C:Voice Coil Motor
Step Resolution:-
Applications:Camera
Function:Driver - Fully Integrated, Control and Power Stage
EU RoHS Status:ROHS3 Compliant
US ECCN:EAR99
HTS US:8542.39.0001
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LV8082LP-TE-L-H provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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