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Rochester Electronics LA4814V-TLM-E
2-CHANNEL POWER AMPLIFIER
Manufacturer # :LA4814V-TLM-E
Manufacturer :Rochester Electronics
Dasenic # :LA4814V-TLM-E-DS
Datasheet :
LA4814V-TLM-E Datasheet
LA4814V-TLM-E DatasheetCustomer # :
Description : 2-CHANNEL POWER AMPLIFIER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.4095 | $ 0.41 |
| 25+ | $ 0.4013 | $ 10.03 |
| 100+ | $ 0.3849 | $ 38.49 |
| 500+ | $ 0.3686 | $ 184.3 |
| 1000+ | $ 0.3481 | $ 348.1 |
In Stock: 12000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4095
Total :$ 0.41
Delivery :
Payment :
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LA4814V-TLM-E information
Rochester Electronics LA4814V-TLM-E technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Standby
- Mounting Type:Surface Mount
- Package / Case:14-LSSOP (0.173", 4.40mm Width) + 2 Heat Tabs
- Type:Class AB
- Output Type:1-Channel (Mono) or 2-Channel (Stereo)
- Supplier Device Package:14-HSSOP
- Voltage - Supply:2.7V ~ 7V
- Max Output Power x Channels @ Load:700mW x 1 @ 8Ohm
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.33.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
LA4814V-TLM-E provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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