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1 : $2783.6000
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Onsemi KAI-2093-CBA-CB-BA
IMAGE SENSOR CCD 2.1MP 32CDIP
Manufacturer # :KAI-2093-CBA-CB-BA
Manufacturer :Onsemi
Dasenic # :KAI-2093-CBA-CB-BA-DS
Datasheet :
KAI-2093-CBA-CB-BA Datasheet
KAI-2093-CBA-CB-BA DatasheetCustomer # :
Description : IMAGE SENSOR CCD 2.1MP 32CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2783.6000 | $ 2783.6 |
In Stock: 1118
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2783.6
Total :$ 2783.60
Delivery :
Payment :
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KAI-2093-CBA-CB-BA information
Onsemi KAI-2093-CBA-CB-BA technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Obsolete
- Operating Temperature:-50°C ~ 70°C (TA)
- Package / Case:32-CDIP Module
- Type:CCD
- Supplier Device Package:32-CDIP
- Voltage - Supply:14.5V ~ 15.5V
- Frames per Second:15
- Pixel Size:7.4µm x 7.4µm
- Active Pixel Array:1920H x 1080V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KAI-2093-CBA-CB-BA provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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