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Onsemi KAI-02170-FBA-JD-AE

IC IMAGE SENSOR CCD 67CPGA
part number has RoHS
Manufacturer # :KAI-02170-FBA-JD-AE
Manufacturer :Onsemi
Dasenic # :KAI-02170-FBA-JD-AE-DS
Customer # :
Description : IC IMAGE SENSOR CCD 67CPGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 3000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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KAI-02170-FBA-JD-AE information

  • Onsemi KAI-02170-FBA-JD-AE technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Active
  • Operating Temperature:-50°C ~ 70°C
  • Package / Case:67-BFCPGA Module
  • Type:CCD
  • Supplier Device Package:67-CPGA (33.02x20.07)
  • Voltage - Supply:14.5V ~ 15.5V
  • Frames per Second:60
  • Pixel Size:7.4µm x 7.4µm
  • Active Pixel Array:1920H x 1080V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
KAI-02170-FBA-JD-AE provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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