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Rochester Electronics HLMP6305AGR

LED RED CLEAR 2SMD SMD
part number has RoHS
Manufacturer # :HLMP6305AGR
Manufacturer :Rochester Electronics
Dasenic # :HLMP6305AGR-DS
Customer # :
Description : LED RED CLEAR 2SMD SMD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0975$ 0.1
25+$ 0.0955$ 2.39
100+$ 0.0916$ 9.16
500+$ 0.0878$ 43.9
1000+$ 0.0829$ 82.9
In Stock: 40800
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0975
Total :$ 0.10
Delivery :
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HLMP6305AGR information

  • Rochester Electronics HLMP6305AGR technical specifications, attributes, parameters.
  • Category:Optoelectronics Devices/LED Indication - Discrete
  • Product Status:Active
  • Color:Red
  • Features:-
  • Mounting Type:Surface Mount
  • Package / Case:2-SMD, Gull Wing
  • Size / Dimension:2.10mm L x 2.20mm W
  • Height ( Max):2.92mm
  • Supplier Device Package:2-SMD
  • Configuration:-
  • Current - Test:20mA
  • Voltage - Forward ( Vf) ( Typ):1.8V
  • Millicandela Rating:12mcd
  • Wavelength - Peak:635nm
  • Viewing Angle:25°
  • Lens Color:Colorless
  • Lens Transparency:Clear
  • Lens Style:Round with Domed Top
  • Lens Size:2mm, T-3/4
  • Wavelength - Dominant:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
HLMP6305AGR provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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