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Rochester Electronics HCPL0639R2
Manufacturer # :HCPL0639R2
Manufacturer :Rochester Electronics
Dasenic # :HCPL0639R2-DS
Datasheet : HCPL0639R2 Datasheet
Customer # :
Description : 10MBIT/S LOGIC DUAL CHANNEL HIGH
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 7218
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.166
Total :$ 5.17
Delivery :
Payment :
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Rochester Electronics HCPL0639R2 technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Logic Output
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Input Type:DC
- Output Type:Open Collector, Schottky Clamped
- Number of Channels:2
- Supplier Device Package:8-SOIC
- Voltage - Supply:4.5V ~ 5.5V
- Data Rate:10Mbps
- Current - Output / Channel:15 mA
- Voltage - Isolation:3750Vrms
- Rise / Fall Time ( Typ):17ns, 5ns
- Inputs - Side 1/ Side 2:2/0
- Common Mode Transient Immunity ( Min):25kV/µs
- Propagation Delay tp L H / tp H L ( Max):75ns, 75ns
- Voltage - Forward ( Vf) ( Typ):1.75V (Max)
- Current - D C Forward ( If) ( Max):-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
HCPL0639R2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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