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Rochester Electronics H11G2TVM
Manufacturer # :H11G2TVM
Manufacturer :Rochester Electronics
Dasenic # :H11G2TVM-DS
Datasheet : H11G2TVM Datasheet
Customer # :
Description : DARLINGTON OUTPUT OPTOCOUPLER, 7
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1528
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.1241
Total :$ 1.12
Delivery :
Payment :
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H11G2TVM information
Rochester Electronics H11G2TVM technical specifications, attributes, parameters.
- Category:Isolators/Optoisolators - Transistor, Photovoltaic Output
- Product Status:Active
- Operating Temperature:-40°C ~ 100°C
- Mounting Type:Through Hole
- Package / Case:6-DIP (0.400", 10.16mm)
- Input Type:DC
- Output Type:Darlington with Base
- Number of Channels:1
- Supplier Device Package:6-DIP
- Current - Output / Channel:-
- Voltage - Isolation:4170Vrms
- Rise / Fall Time ( Typ):-
- Voltage - Output ( Max):80V
- Voltage - Forward ( Vf) ( Typ):1.3V
- Current - D C Forward ( If) ( Max):60 mA
- Current Transfer Ratio ( Min):1000% @ 10mA
- Current Transfer Ratio ( Max):-
- Turn On / Turn Off Time ( Typ):5µs, 100µs
- Vce Saturation ( Max):1V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.49.8000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
H11G2TVM provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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