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1 : $0.4290
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Rochester Electronics FST162861MTDX
IC BUS SWITCH 10 X 1:1 48TSSOP
Manufacturer # :FST162861MTDX
Manufacturer :Rochester Electronics
Dasenic # :FST162861MTDX-DS
Datasheet :
FST162861MTDX Datasheet
FST162861MTDX DatasheetCustomer # :
Description : IC BUS SWITCH 10 X 1:1 48TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.4290 | $ 0.43 |
| 25+ | $ 0.4205 | $ 10.51 |
| 100+ | $ 0.4033 | $ 40.33 |
| 500+ | $ 0.3861 | $ 193.05 |
| 1000+ | $ 0.3647 | $ 364.7 |
In Stock: 13374
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.429
Total :$ 0.43
Delivery :
Payment :
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FST162861MTDX information
Rochester Electronics FST162861MTDX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:48-TFSOP (0.240", 6.10mm Width)
- Type:Bus Switch
- Supplier Device Package:48-TSSOP
- Voltage - Supply:4V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:10 x 1:1
- Independent Circuits:2
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FST162861MTDX provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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