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1 : $0.2535
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Rochester Electronics FSA8029UMX
AUDIO JACK SEND / END DETECTION
Manufacturer # :FSA8029UMX
Manufacturer :Rochester Electronics
Dasenic # :FSA8029UMX-DS
Datasheet :
FSA8029UMX Datasheet
FSA8029UMX DatasheetCustomer # :
Description : AUDIO JACK SEND / END DETECTION
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.2535 | $ 0.25 |
| 25+ | $ 0.2485 | $ 6.21 |
| 100+ | $ 0.2383 | $ 23.83 |
| 500+ | $ 0.2282 | $ 114.1 |
| 1000+ | $ 0.2155 | $ 215.5 |
In Stock: 29603
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2535
Total :$ 0.25
Delivery :
Payment :
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FSA8029UMX information
Rochester Electronics FSA8029UMX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Audio Special Purpose
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:10-UFQFN
- Number of Channels:1
- Interface:Logic
- Specifications:4-Pole
- Supplier Device Package:10-UMLP (1.8x1.4)
- Voltage - Supply:2.5V ~ 4.3V
- Applications:Communication Systems, Consumer Audio
- Function:Detection Switch
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FSA8029UMX provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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