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Rochester Electronics FPF2200
Manufacturer # :FPF2200
Manufacturer :Rochester Electronics
Dasenic # :FPF2200-DS
Datasheet : FPF2200 Datasheet
Customer # :
Description : BUFFER/INVERTER BASED PERIPHERAL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 15248
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3705
Total :$ 0.37
Delivery :
Payment :
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FPF2200 information
Rochester Electronics FPF2200 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Power Distribution Switches, Load Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Features:Auto Restart, Load Discharge, Status Flag
- Mounting Type:Surface Mount
- Package / Case:6-VDFN Exposed Pad
- Input Type:Non-Inverting
- Output Type:P-Channel
- Interface:On/Off
- Supplier Device Package:6-MicroFET (2x2)
- Ratio - Input: Output:1:1
- Voltage - Supply ( Vcc/ Vdd):Not Required
- Number of Outputs:1
- Fault Protection:Current Limiting (Fixed), Over Temperature, UVLO
- Output Configuration:High Side
- Rds On ( Typ):140mOhm
- Voltage - Load:1.8V ~ 5.5V
- Current - Output ( Max):500mA
- Switch Type:General Purpose
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FPF2200 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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