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Rochester Electronics FOD3120TSR2
Manufacturer # :FOD3120TSR2
Manufacturer :Rochester Electronics
Dasenic # :FOD3120TSR2-DS
Datasheet : FOD3120TSR2 Datasheet
Customer # :
Description : FET OUTPUT OPTOCOUPLER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 4686
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.116
Total :$ 1.12
Delivery :
Payment :
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FOD3120TSR2 information
Rochester Electronics FOD3120TSR2 technical specifications, attributes, parameters.
- Category:Isolators/Isolator Gate Drivers
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 100°C
- Mounting Type:Surface Mount
- Package / Case:8-SMD, Gull Wing
- Technology:Optical Coupling
- Approval Agency:UL
- Number of Channels:1
- Supplier Device Package:8-SMD
- Current - Output High, Low:2A, 2A
- Voltage - Isolation:5000Vrms
- Current - Peak Output:3A
- Rise / Fall Time ( Typ):60ns, 60ns
- Common Mode Transient Immunity ( Min):35kV/µs
- Propagation Delay tp L H / tp H L ( Max):400ns, 400ns
- Pulse Width Distortion ( Max):100ns
- Voltage - Forward ( Vf) ( Typ):1.5V
- Current - D C Forward ( If) ( Max):25 mA
- Voltage - Output Supply:15V ~ 30V
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8541.49.8000
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FOD3120TSR2 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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