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Onsemi FNB51060TDS

MODULE SPM 600V 10A SPM55
part number has RoHS
Manufacturer # :FNB51060TDS
Manufacturer :Onsemi
Dasenic # :FNB51060TDS-DS
Customer # :
Description : MODULE SPM 600V 10A SPM55
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
4+$ 8.1364$ 32.55
10+$ 8.1364$ 81.36
100+$ 8.1364$ 813.64
1000+$ 8.1364$ 8136.4
10000+$ 8.1364$ 81364
In Stock: 16572
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.1364
Total :$ 8.14
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FNB51060TDS information

  • Onsemi FNB51060TDS technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Obsolete
  • Mounting Type:Through Hole
  • Package / Case:20-PowerDIP Module (1.043", 26.50mm)
  • Type:IGBT
  • Configuration:3 Phase
  • Voltage:600 V
  • Current:10 A
  • Voltage - Isolation:1500Vrms
  • EU RoHS Status:ROHS3 Compliant
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FNB51060TDS provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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