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Onsemi FMB3906
Manufacturer # :FMB3906
Manufacturer :Onsemi
Dasenic # :FMB3906-DS
Datasheet : FMB3906 Datasheet
Customer # :
Description : TRANS 2PNP 40V 0.2A 6SSOT
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In Stock: 34940
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.102
Total :$ 0.10
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FMB3906 information
Onsemi FMB3906 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:SOT-23-6 Thin, TSOT-23-6
- Power - Max:700mW
- Supplier Device Package:SuperSOT™-6
- Transistor Type:2 PNP (Dual)
- Current - Collector ( Ic) ( Max):200mA
- Voltage - Collector Emitter Breakdown ( Max):40V
- Vce Saturation ( Max) @ Ib, Ic:400mV @ 5mA, 50mA
- Current - Collector Cutoff ( Max):-
- D C Current Gain (h F E) ( Min) @ Ic, Vce:100 @ 10mA, 1V
- Frequency - Transition:200MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0075
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FMB3906 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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